Subject: A tricky modelling/meshing problem. Any tips? Author: sti_sti2000 sis@ Date: 2002-03-12 02:26:00If anyone can give me some guidelines on how to tackle this modelling problem, it would be most appreciated.
I am modelling micro-packaging produced with integrated circuit technology. I have pretty much quadratic geometries (no curved surfaces) but there are slanted wall etchings for holes and for a main cavity.
The dimension of the bulk of the device is on the order of 5 mm long and 0.35 mm deep. But there are several thin layers of about 0.001 mm on the upper and bottom surfaces, as well as within the etched holes and etched large cavity. I can use 1/2 symmetry for my model, but not 1/4 symmetry.
My first problem is to get this part modelled, meshed, and solved in a reasonable time with the 1 CPU computer that we have available. So here is the first roadblock: meshing.
On the suggestion of others, and because of the slanted etched walls and various other details (which will come later) I am using solid modelling. Because of the rather quadratic geometry, I would assume that mapped meshing would be the best bet. But is this so? The difficulty is that I have 0.001 mm layers modelled together with a bulk of 5 mm by 2.5 mm by 0.35 micron.
How do people tackle this?
If someone has the answer to use a combination of shell and solid modelling, then I would like to know how this is possible, when I have additional 3D geometric detail (copper feedthroughs, etc.).
Thanks for any help!
Steven Isaacs Hymite Aps DTU, Building 325 DK 2800 Lyngby, Denmark sis@h...